Nanotech 2010 Vol. 2
Nanotech 2010 Vol. 2
Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational

Compact Modeling Chapter 11

Compact Modeling of Signal Transients for Dispersionless Interconnects With Resistive, Capacitive and Inductive Terminal Loads

Authors: Chi Liu, Z. Zhou, X. Lin, J. Xia, X. Zhang, J. He

Affilation: Peking University, China

Pages: 809 - 812

Keywords: compact model, interconnect, dispersionless, transients, transmission line

Abstract:
In this paper, compact models for transient response of dispersionless interconnects are rigorously derived with resistive, inductive and capacitive terminal loads. The proposed compact models are verified by the HSPICE simulation with high accuracy and the physical insight of the developed compact models is also demonstrated.

Compact Modeling of Signal Transients for Dispersionless Interconnects With Resistive, Capacitive and Inductive Terminal Loads

ISBN: 978-1-4398-3402-2
Pages: 862
Hardcopy: $189.95