Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?

	Nanotech 2010 Vol. 2 Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational Chapter 1: Electronics & Photonics
	Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?
Authors:	R. Pufall, B. Michel, E. Kaulfersch
Affilation:	Infineon Technology AG, DE
Pages:	1 - 4
Keywords:	adhesion, moulding compound, degradation, accelerated testing
Abstract:	It is well known that high temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesions to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. Also during normal operation of electronically components heat is generated locally (bond wire, or chip surface) degrading the moulding compound and reducing the adhesion which in extreme cases can destroy the metallisation or bond wires.
ISBN:	978-1-4398-3402-2
Pages:	862
Hardcopy:	$189.95

Order:	Mail/Fax Form
Special:	3 CD Set — 15% off with Free Shipping
Up