Nano Science and Technology Institute
Nanotech 2009 Vol. 3
Nanotech 2009 Vol. 3
Nanotechnology 2009: Biofuels, Renewable Energy, Coatings, Fluidics and Compact Modeling
 
Chapter 8: Micro and Nano Fluidics
 

Engineered Nanostructures for High Thermal Conductivity Substrates

Authors:K.K. Varanasi, P. Chamarthy, S. Chauhan, P. de Bock, T. Deng, A. Kulkarni, G. Mandrusiak, B. Rush, B. Russ, L. Denault, S. Weaver, F. Gerner, Q. Leland, K. Yerkes
Affilation:Massachusetts Institute of Technology, US
Pages:505 - 508
Keywords:heat pipes, electronic cooling, wettability, superhydrophobic, superhydrophilic
Abstract:In the DARPA Thermal Ground Plane (TGP) program, GE and its partners, the University of Cincinnati and the Air Force Research Laboratory, are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. This paper presents results from Phase 1 of this program.
Engineered Nanostructures for High Thermal Conductivity SubstratesView PDF of paper
ISBN:978-1-4398-1784-1
Pages:694
Hardcopy:$179.95
 
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