Nanotech 2009 Vol. 3
Nanotech 2009 Vol. 3
Nanotechnology 2009: Biofuels, Renewable Energy, Coatings, Fluidics and Compact Modeling

Micro and Nano Fluidics Chapter 8

Engineered Nanostructures for High Thermal Conductivity Substrates

Authors: K.K. Varanasi, P. Chamarthy, S. Chauhan, P. de Bock, A. Kulkarni, G. Mandrusiak, B. Rush, B. Russ, L. Denault, S. Weaver, F. Gerner, Q. Leland, K. Yerkes

Affilation: Massachusetts Institute of Technology, United States

Pages: 505 - 508

Keywords: heat pipes, electronic cooling, wettability, superhydrophobic, superhydrophilic

In the DARPA Thermal Ground Plane (TGP) program, GE and its partners, the University of Cincinnati and the Air Force Research Laboratory, are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. This paper presents results from Phase 1 of this program.

Engineered Nanostructures for High Thermal Conductivity Substrates

ISBN: 978-1-4398-1784-1
Pages: 694
Hardcopy: $179.95