Varanasi K.K., Chamarthy P., Chauhan S., de Bock P., Kulkarni A., Mandrusiak G., Rush B., Russ B., Denault L., Weaver S., Gerner F., Leland Q., Yerkes K.
Massachusetts Institute of Technology, US
Keywords: electronic cooling, heat pipes, superhydrophilic, superhydrophobic, wettability
In the DARPA Thermal Ground Plane (TGP) program, GE and its partners, the University of Cincinnati and the Air Force Research Laboratory, are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. This paper presents results from Phase 1 of this program.
Journal: TechConnect Briefs
Volume: 3, Nanotechnology 2009: Biofuels, Renewable Energy, Coatings, Fluidics and Compact Modeling
Published: May 3, 2009
Pages: 505 - 508
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: Micro & Bio Fluidics, Lab-on-Chip
ISBN: 978-1-4398-1784-1