Nanotech 2009 Vol. 3
Nanotech 2009 Vol. 3
Nanotechnology 2009: Biofuels, Renewable Energy, Coatings, Fluidics and Compact Modeling

Micro and Nano Fluidics Chapter 8

Engineered Nanostructures for High Thermal Conductivity Substrates

Authors: K.K. Varanasi, P. Chamarthy, S. Chauhan, P. de Bock, A. Kulkarni, G. Mandrusiak, B. Rush, B. Russ, L. Denault, S. Weaver, F. Gerner, Q. Leland, K. Yerkes

Affilation: Massachusetts Institute of Technology, United States

Pages: 505 - 508

Keywords: heat pipes, electronic cooling, wettability, superhydrophobic, superhydrophilic

Abstract:
In the DARPA Thermal Ground Plane (TGP) program, GE and its partners, the University of Cincinnati and the Air Force Research Laboratory, are developing a new thermal technology that will enable a monumental thermal technological leap to an entirely new class of electronics, particularly electronics for use in high-tech military systems. This paper presents results from Phase 1 of this program.

Engineered Nanostructures for High Thermal Conductivity Substrates

ISBN: 978-1-4398-1784-1
Pages: 694
Hardcopy: $179.95