Authors: J. Berthier, F. Grossi, L. Di Cioccio
Affilation: Cea-Leti Minatec, France
Pages: 260 - 263
Keywords: die, alignment, modes, yaw, roll, minimal surface
To create advanced Microsystems by 3D integration, die-to-wafer assembly is required to obtain fast and reliable packaging. In order to overcome the main difficulties of current techniques, self-assembly methods are promising due to their serial aspect. The aim of this work is to understand the mechanisms of self alignment. Using “Surface Evolver” software, we were able to study misalignments of the system and their evolutions.