Authors: C.J. Han, S.H. Yu, S.-J. Hong, Y.S. Kim, J.-I. Han
Affilation: Korean Electronics Technology Institute, Korea
Pages: 432 - 434
Keywords: TIM, LED, thermal, dissipation
Thermal dissipation problem for LED is critical for high efficacy and reliability. Inorganic filled grease type thermal interface material (TIM) has widespread use for heat management of LED. Conventional TIM materials, however, has relative low termal conductiviey (~ 2.0W/mK)rather than metals like solder. To achieve high thermal conductivity comparable for metal, novel nano composite material is synthesized with nano fiber and filler.