Nanotech 2008 Vol. 3
Nanotech 2008 Vol. 3
Nanotechnology 2008: Microsystems, Photonics, Sensors, Fluidics, Modeling, and Simulation - Technical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, Volume 3

MEMS & NEMS Chapter 4

Non traditional dicing of MEMS devices

Authors: S. Sullivan, T. Yoshikawa

Affilation: DISCO Corp., Japan

Pages: 493 - 496

Keywords: dicing, MEMS, laser, contamination, vibration, thermal, ESD

Abstract:
Dicing of MEMS contains a host of challenges. Contamination, vibration, thermal, and electrical sensitivity dictate modified or non traditional dicing processes. Focusing a laser beam inside of the silicon substrate creating a modified layer is one such non traditional dicing process. This completely dry process addresses most of the challenges to dicing MEMS. This paper will compare the SD laser process to a modified blade dicing of MEMS.


ISBN: 978-1-4200-8505-1
Pages: 940
Hardcopy: $159.95

2015 & Newer Proceedings

Nanotech Conference Proceedings are now published in the TechConnect Briefs

NSTI Online Community