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 | Nanotech 2008 Vol. 3
Nanotechnology 2008: Microsystems, Photonics, Sensors, Fluidics, Modeling, and Simulation - Technical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, Volume 3
Chapter 4: MEMS & NEMS |
| | Non traditional dicing of MEMS devices | | Authors: | S. Sullivan, T. Yoshikawa | | Affilation: | DISCO Corp., JP | | Pages: | 493 - 496 | | Keywords: | dicing, MEMS, laser, contamination, vibration, thermal, ESD | | Abstract: | Dicing of MEMS contains a host of challenges. Contamination, vibration, thermal, and electrical sensitivity dictate modified or non traditional dicing processes. Focusing a laser beam inside of the silicon substrate creating a modified layer is one such non traditional dicing process. This completely dry process addresses most of the challenges to dicing MEMS. This paper will compare the SD laser process to a modified blade dicing of MEMS. | | ISBN: | 978-1-4200-8505-1 |
| Pages: | 940 |
| Hardcopy: | $199.99 |
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