Nano Science and Technology Institute
Nanotech 2008 Vol. 1
Nanotech 2008 Vol. 1
Nanotechnology 2008: Materials, Fabrication, Particles, and Characterization - Technical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, Volume 1
 
Chapter 2: Nano Materials & Composites
 

Metallic submicron wires and nanolawn for microelectronic packaging. Concept and first evaluation

Authors:S. Fiedler, M. Zwanzig, R. Schmidt, W. Scheel
Affilation:Fraunhofer Institut Zuverlässigkeit und Mikrointegration (IZM), Berlin, DE
Pages:214 - 217
Keywords:nanolawn, flip-chip, bonding, joining
Abstract:Starting with a brief review of submicron wire production techniques, promising applications of submicron and nano wires are discussed. Observed attractive properties of metal rod decorated metal surfaces, so called nano lawn, for low energy joining and flip chip bonding are presented. The potential of these materials for microelectronic packaging by decoration of joining parts is shown: Due to close proximity of different grain sizes in intercalated nanolawn pieces (joining partners) recrystallization phenomena can be used for fluxless joining. Thus, new strategies for electrical interconnection of functional components can be designed by choice of morphology and composition of galvanically cast metal rods and wires. The experimental proof of principle has been performed with gold nanolawn. Based on original work new applications are presented. Related use of structures decorated with submicron wires and nanowires is discussed for microsystem technology.
Metallic submicron wires and nanolawn for microelectronic packaging. Concept and first evaluationView PDF of paper
ISBN:978-1-4200-8503-7
Pages:1,118
Hardcopy:$159.95
 
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