Nanotech 2008 Vol. 1
Nanotech 2008 Vol. 1
Nanotechnology 2008: Materials, Fabrication, Particles, and Characterization - Technical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, Volume 1

Nano Materials & Composites Chapter 2

Preparation of Copper-Bearing Nanofluids for Thermal Applications

Authors: A.F. Velasco, O.J. Perales-Perez, G. Gutiérrez

Affilation: University of Puerto Rico, Puerto Rico

Pages: 424 - 427

Keywords: nanoparticles, nanofluids, copper, thermal applications

Stable suspension of nanometer solid particles in suitable solvents, so-called nanofluids, has shown enhanced thermal conductivity when compared with the fluid base. This feature enables these suspensions to be considered a promising material for efficient and effective thermal management in different systems, [1-4]. Nanofluids bearing metal nanoparticles, e. g. Ag or Cu exhibit, in general, more remarkable thermal conductivity than those containing oxide nanoparticles [5-7]. Accordingly, the present research is focused on the optimization of the size-controlled synthesis conditions of Cu nanoparticles and their subsequent stabilization in ethylene glycol. The thermal conductivity of these suspensions will be measured as a function of nanoparticle size and nanoparticle volumetric load in the suspending media. Cu nanoparticles have been synthesized through the reduction of Cu ions by hydrazine as well as by taking advantage of the reducing power of polyol solutions. Solid products were then characterized by XRD, SEM and TEM techniques. The preparation of the copper-bearing stable nanofluids is attempted by coating nanoparticles with surfactant agents followed by their dispersion in ethylene glycol.

Preparation of Copper-Bearing Nanofluids for Thermal Applications

ISBN: 978-1-4200-8503-7
Pages: 1,118
Hardcopy: $159.95