Nanotech 2007 Vol. 3
Nanotech 2007 Vol. 3
Technical Proceedings of the 2007 NSTI Nanotechnology Conference and Trade Show, Volume 3

Compact Modeling Chapter 7

Process Aware Hybrid SPICE Models using TCAD and Silicon Data

Authors: Y. Mahotin, S. Tirumala, X. Lin and D. Pramanik

Affilation: Synopsys Inc., United States

Pages: 684 - 686

Keywords: SPICE model, process aware

Abstract:
This paper describes the methodology for extraction of process dependant hybrid SPICE compact model parameters using calibrated TCAD data and measured Silicon data. Process dependence of electrical curves is, initially, estimated using TCAD data set. The knowledge of process dependence is subsequently utilized to generate device electrical curves centered on typical measured Silicon data. These newly generated device electrical curves are used to extract hybrid SPICE model parameters as explicit functions of process parameter variations.


ISBN: 1-4200-6184-4
Pages: 732
Hardcopy: $139.95

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