Nano Science and Technology Institute
Nanotech 2007 Vol. 3
Nanotech 2007 Vol. 3
Technical Proceedings of the 2007 NSTI Nanotechnology Conference and Trade Show, Volume 3

Chapter 3:

Sensors & MEMS

-Design and Characterization of new GaAs Micromechanical Thermal Converter developed for Microwave Power Sensor
 J. Jakovenko, M. Husak and T. Lalinsky
 Czech Technical University in Prague, Faculty of Electrical Engineering, CZ
-Development of Materials and Sensors for the U.S. Army’s Active Coatings Technology Program
 J.L. Zunino III
 U.S. Army ARDEC, US
-Angular Orientation-Specific Directed Self-assembly Enabling the Integration of Small Dies
 R.J. Knuesel, S. Bose, W. Zheng and H.O. Jacobs
 University of Minnesota, US
-Silex offers sub 50 um pitch for through wafer connections in up to 600 um thick substrates
 T. Bauer
 Silex Microsystems, SE
-Neural Network-Based MEMS Failure Probability Prediction
 A.A. Ilumoka and H. Tan
 UNIVERSITY OF HARTFORD, US
-Au Nanoparticle Coupled- Surface Plasmon Resonance Chemical Sensor for Sensitivity Enhancement
 J-H Kim, S-W Choi, H-S Kim and Y-J Cho
 Ajou University, KR
-Spray Pyrolysis Technology for Nanodimensional Film Gas Sensors Manufacturing
 S. Dmitriev, T. Goglidze and I. Dementiev
 Moldova State University, MD
-Carbonate ion sensing electrode membrane based on poly(vinyl chloride) and its property characteristics
 D. Kim, H-C. Kim, G. Byun, S-D. Park and M. Ree
 POETECH, KR
-Chemical Nano-Sensor Development and Characterization
 A.J. Jin
 Hoda Global Company, US
-Reduced-order modelling of the Reynolds equation for flexible structures
 A. Missoffe, J. Juillard and D. Aubry
 SUPELEC, FR
-The effect of damping for the rate of flow in the micropump
 W.P. Lan and J.S. Chang
 National Taiwan University, TW
-Adaptive Energy Integration of Non-Equilibrium Green's Function
 O. Baumgartner, M. Karner, S. Holzer, M. Pourfath, T. Grasser and H. Kosina
 TU Wien, AT
-Numerical Study of Flame Acceleration in Microchannel
 A. Chaudhuri, C. Guha and T.K. Dutta
 Jadavpur University, IN
-Shear Piezoresistance Coefficient Pi44 of n-type Silicon
 Y. Kanda and K. Matsuda
 Kojundo Chemical Laboratory Co. LTD, JP
-A semi-analytical model for calculating touch-point pressure and pull-in voltage for clamped diaphragms with residual stress
 A. Sharma and P.J. George
 University, IN
-Heat Conduction Analysis of Nano-tip in Thermal-assisted Data Storage via Molecular Dynamics Simulation
 X.J. Liu, J.P. Yang and Y.W. Yang
 Data Storage Institute, SG
-Optimization of Disk-type Piezoelectric Transformers
 C-W. Kuo, C-Y. Kang, Y-Y. Huang, C-K. Lee and Y-J. Yang
 National Taiwan University, TW
-Electrical equivalent circuit for air and liquid characterization of a multilayer micromembrane with piezoelectric actuation and read-out capabilities
 T. Alava, C. Ayela and L. Nicu
 Laboratory for Analysis and Architecture of systems LAAS-CNRS, FR
-Transient Analysis of Snap-through Behavior of a MEMS Optical Switch
 Y-Y Huang and Y-J Yang
 National Taiwan University, TW
-A Novel Topology Optimization Scheme for Micro Electro-Thermo-Mechanical Domains
 M. Motiee, A. Khajepour and R.R. Mansour
 University of Waterloo, CA
-A Simulation-Based Hybrid Optimization Technique for Low Noise Amplifier Integrated Circuit Design Automation
 Y. Li and S-M Yu
 National Chaio Tung University, TW
-Modeling hysteresis and creep characteristics of a carbon-nanotube-reinforced electroactive actuator.
 K. Sohn, S.R. Shin, B-J Yi, S.I. Kim and S.J. Kim
 Hanyang university, KR
-Analytical and Computational Solutions to Piezoelectric Bending: A Comparative Study
 A. Sabet and X.J. Avula
 Washington University in St. Louis, US
-Perturbation Stochastic Finite Element Analysis of Thermoelastic Quality Factor of Micro-Resonators
 S. Lepage and J.C. Golinval
 University of Liege, BE
-Characterization and Optimization Design of the Polymer-based Capacitive Micro-arrayed Ultrasonic Transducer
 D.Y. Chiou, M.Y. Chen, M.W. Chang and T.M. Deng
 RFID Technology Center/Industrial Technology Research Institute (RTC/ITRI), TW
-Micro mixture: Size effect of micro mixing
 R. Khelfaoui, B. Benyoucef and S. Colin
 ASSISTANT, DZ
-An Architecture of Quantum CPU
 V. Téllez, A. Campero, C. Iuga and G. Duchen
 Universidad Autonoma Metropolitana, MX
-The Logical Elements “And”/ “Or” are Established on the Elements with Punch-Through and Deformation Space Charge Regions
 I. Mats
 Diatex, Selected Texno-Fix, CA
-On the stability length of fluid/liquid interfaces sustained by microfabricated pillars
 J. Berthier, Van Man Tran, H. Jeanson and N. Sarrut
 CEA/LETI, FR
-Simulation of ac-electroosmotic flows for concentration of particles on biosensors
 L. Tanguy, G. Casalis and L. Nicu
 LAAS-CNRS, FR
-Compact Electromagnetic XY Stage with Nano Scale Resolution and Vibration Resistance
 K.I. Lee, S.H. Kim, J.W. Cho, J.K. Shin, J.C. Yoo and Y.J. Choi
 Korea Electronics Technology Institute, KR
-MEMS Humidity Structure with Cantilever – Simulation of Behaviour
 P. Suchanek and M. Husak
 Czech Technical University in Prague, CZ
-Fabry-Perot Diaphragm Fiber Optic Sensor (DFOS) for Acoustic Detection
 Y. Sun, G. Feng, G. Georgiou, I. Padron, E. Niver, K. Noe and K.K. Chin
 New Jersey Institute of Technology, US
-Bonding Pad with Reduced Capacity
 I. Mats and V. Tarcenco
 Select Techno-Fix Ltd, CA
-A study on the novel micromixer with chaotic flow
 S.H. Lee, H.J. Kang and B.K. Choi
 Sogang University, KR
-Global MEMS Equipment and Materials Markets and Opportunities
 L. Sheet
 SEMI, US
-Micromechanical GaAs Thermal Convertor for Gas Sensors
 J. Jakovenko, M. Husák, T. Lalinsky, M. Drzík and G. Vanko
 Czech Technical University in Prague, Faculty of Electrical Engineering, CZ
-Design of Radiation Tolerant Readout System for an Integrated SRAM Based Neutron Detector
 P. Malinowski, D. Makowski, G. Jablonski and A. Napieralski
 Technical University of Lodz, PL
-Multisensor Network for Distance Data Pick-up
 M. Husak, J. Jakovenko and T. Vitek
 Czech Technical University in Prague, CZ
-Multi-walled Carbon Nanotube Film as Strain Sensors for Structural Vibration Control
 X. Li and C. Levy
 Florida International University, US
ISBN:1-4200-6184-4
Pages:732
Hardcopy:$139.95
 
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