MEMS/NEMS: Modeling & Characterization

	Nanotech 2007 Vol. 3 Technical Proceedings of the 2007 NSTI Nanotechnology Conference and Trade Show, Volume 3 Chapter 2: MEMS/NEMS: Modeling & Characterization
-	The mechanical stiffness and the size effect of the silicon based nano-structures using molecular dynamic (MD) simulation
	C.A. Yuan, O. van der Sluis, G.Q. Zhang, L.J. Ernst, W.D. van Driel and R.B.R. van Silfhout
	Delft University of Technology, NL
-	Investigation of Vector Discretization Schemes for Box Volume Methods
	O. Triebl and T. Grasser
	Christian Doppler Laboratory for TCAD in Microelectronics, AT
-	A new compact scalable circuit model for RF MEMS switches
	H.M.R. Suy, H.G.A. Huizing, P.G. Steeneken and O.I. Yanson
	NXP Semiconductors, NL
-	New Analysis Method for Coupled-Field Micro Devices
	M. Motiee, A. Khajepour and R.R. Mansour
	University of Waterloo, CA
-	Frequency Domain Modeling of SAW Devices
	W.C. Wilson and G.M. Atkinson
	NASA Langley Research Center, US
-	Modeling and Dynamics of Coupled Dome-shaped Micromechanical Oscillators
	T. Sahai and A.T. Zehnder
	Cornell University, US
-	Optimization of Masks for High Aspect Ration UV-Lithographic Patterning
	U. Triltsch and S. Büttgenbach
	Technische Universität Braunschweig, DE
-	A Study on the Electrical Properties of Plasma Nitrided Oxide Gate Dielectric in Flash Memory
	M. Park, K. Suh, S. Lee, H. Kang, K. Kim and K. Kim
	Samsung Electronics, KR
-	A Method for Semi-Automated Modeling of Analog-Mixed Signal Systems in Automotive Applications based on Transient Simulation Data
	H. Mielenz, R. Doelling and W. Rosenstiel
	Robert Bosch Group, DE
-	Genetic Algorithm for the Design of Microchip Flow Cytometers
	H. Bang, W.G. Lee, H. Yun, J.K. Min, C. Chung, J.K. Chang and D.-C. Han
	Seoul National University, KR
-	FEM Simulation for demolding process in thermal imprint lithography
	Z. Song, J. Lee and S. Park
	Louisiana State University, US
-	Study of Thermal Efficiency Optimization in a Twin-bubble MEMS Micro-injector
	H-K Tang, F-C Tseng, W.W. Wang, I-Y Lee, C-K Lee and K. Lee
	BenQ Corporation, TW
ISBN:	1-4200-6184-4
Pages:	732
Hardcopy:	$139.95

Order:	Mail/Fax Form
Up