Fabrication of Cu-encapsulated Carbon Nanotube Inductors
Authors:
B.C. Lee, J.O. Lee, Y.-K. Choi and J.-B. Yoon
Affilation:
Korea Institute of Science and Technology(KIST), KR
Pages:
45 - 48
Keywords:
CNT, RF-MEMS, Inductor, Interconnects
Abstract:
In this works, we developed a top-down fabrication method to pattern and form carbon nanotube(CNT) interconnects with Cu encapsulation. Using this method, we fabricated spiral Cu-encapsulated CNT inductors for RF ICs and investigated the inductance of 0.55nH and quality(Q-) factor of 66 at 8.5GHz.
