Fabrication of Cu-encapsulated Carbon Nanotube Inductors

	Nanotech 2007 Vol. 1 Technical Proceedings of the 2007 NSTI Nanotechnology Conference and Trade Show, Volume 1 Chapter 1: Carbon Nanotubes
	Fabrication of Cu-encapsulated Carbon Nanotube Inductors
Authors:	B.C. Lee, J.O. Lee, Y.-K. Choi and J.-B. Yoon
Affilation:	Korea Institute of Science and Technology(KIST), KR
Pages:	45 - 48
Keywords:	CNT, RF-MEMS, Inductor, Interconnects
Abstract:	In this works, we developed a top-down fabrication method to pattern and form carbon nanotube(CNT) interconnects with Cu encapsulation. Using this method, we fabricated spiral Cu-encapsulated CNT inductors for RF ICs and investigated the inductance of 0.55nH and quality(Q-) factor of 66 at 8.5GHz.
ISBN:	1-4200-6182-8
Pages:	726
Hardcopy:	$139.95

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