Papers:
Mechanical Properties Measurements of 0.35-µm BiCMOS MEMS Structures
A new Young’s modulus test structure has been designed and used in our lab. Simple models have been built in simulating lateral and vertical stress gradients. Test structures, measurements and FEA simulations are reported on [...]
MEMS Process Characterization with an on-Chip Device
We have developed a CMOS-compatible, compact device and a simple procedure for measuring three important fabrication characteristics of planar-processed microelectromechanical (MEMS) structures: in-plane over- or under-cut, Young’s Modulus, and comb-drive forces in a MEMS process. [...]
Analytic Damping Model for a Square Perforation Cell
A compact model for a square perforation cell is derived. It is generated both analytically and with 3D FEM simulations of the structure. The model consists of six flow resistances, whose values are simple functions [...]
Simulations of the Anchor Losses in MEM Disk Resonators
MEM (Micro Electro Mechanical) resonators have been proposed as fundamental components in RF transmission systems; especially bulk mode resonators are very attractive devices because of their small size and their high resonance frequencies combined with [...]
Adaptive Control for Reducing the Effect of Damping on the Output Signal of Microgyroscopes
A mixed-level modeling methodology is employed to set up a full system simulation model for microgyroscopes together with the control circuitry in order to investigate the performance of novel adaptive closed-loop control strategies, which allow [...]
Microcantilever Sensor via Second Order Sliding Mode Control
Improved sensor measurements using second-order sliding mode control of a mass sensor based on a microcantilever is considered. The microcantilever-based mass sensor detects mass loading via deflections in nanometer scale. The polymer-coated cantilever is exposed [...]
Parameterizable Library Components for SAW Devices
The lack of integrated design tools for SAW devices has led us to develop tools that in the future will enable integrated design, modeling, simulation, analysis and automatic layout generation of Surface Acoustic Wave (SAW) [...]
Strong and Weak Inversion Mode of MOS in the Design of Direction Sensitivity Matrix
In the article there is presented a new arrangement of a temperature sensor system for air velocity and direction measurement. The system utilizes temperature dependence of the current through the channel of MOS structure. The [...]
Manipulation of Capillary force by Electrowetting for Micromanipulation
Microassembly is the future of MEMS and NEMS technology. But greatest barrier to the idea of micro scale assembly is micromanipulation. The steps in micromanipulation are pickup, moving and releasing and the most difficult part [...]
Multiphysics Modeling and Simulation for a MEMS Thermal-Mechanical Switch
This paper presents the results of finite element analysis (FEA) modeling and simulation including thermal-electric-structural multiphysics contact phenomenon for a MEMS thermal-mechanical DC switch. The parametric model can be used for design optimizations.The switch consists [...]
Smart Pressure Sensor on SOI optimized by Finite Element Analysis for Heatspreader Integration
Finite element analysis is used to maximize the response of the piezoresistive pressure sensor into an integrated heatspreader, designed for high-power electronic device cooling. This study shows the possibility of obtaining small area piezoresistive pressure [...]
Modelling of Torsional Micromirrors with Springs made of Multiple Rotational Serpentine Elements
In general, this paper presents the deduced analytical model and numerical simulation of electrostatically actuated torsional micromirrors with two symmetrical side springs of multiple rotational serpentine elements. Modelling of these kinds of micromirrors is carried [...]
Application of a Design Methodology Using a 2D Micro Scanner
Micro Electro Mechanical Systems (MEMS) are the new and emerging technology of the future and have many applications on different disciplines like biomedical, imaging technology, biology etc. Characterization of motion and vibrations of such systems [...]
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 7, 2006
Industry sector: Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 0-9767985-8-1