 | Nanotech 2005 Vol. 3
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
Chapter 9: MEMS Modeling and Design |
| - | Performance Tradeoffs in MEMS Sensors with High-Finesse Fabry-Perot Interferometry Detection |
| | E.J. Eklund and A.M. Shkel |
| | University of California, Irvine, US |
| - | A Coarse-Grained Tight Binding Method for Electrostatic Analysis of Nanoelectromechanical Systems (NEMS) |
| | Y. Xu, G. Li and N.R. Aluru |
| | Beckman Institute for Advanced Science and Technology, US |
| - | T-CAD Environment for Multi-Material-MEMS Design |
| | U. Triltsch, S. Büttgenbach, D. Straube and H.-J. Franke |
| | Technical University of Braunschweig, DE |
| - | Design, Modelling and Optimisation of Integrated Piezoelectric Micro Power Generators |
| | M. Marzencki, S. Basrour and B. Charlot |
| | TIMA, FR |
| - | A Robust Approach for Estimating Diffusion Constants from Concentration Data in Microchannel Mixers |
| | C.P. Coelho, S. Desai, D. Freeman and J.K. White |
| | Massachusetts Institute of Technology, US |
| - | Electromechanical Modeling of MEMS Resonators with MOSFET Detection |
| | N. Abelé, V. Pott, K. Boucart, F. Casset, K. Séguéni, P. Ancey and A.M. Ionescu |
| | Swiss Federal Institute of Technology of Lausanne, CH |
| - | Elastomeric Composites to Reduce the Effects of Trunnion Mode in Inertial Devices |
| | Ma. Perez and A.M. Shkel |
| | University of California, Irvine, US |
| - | A Method for Solving Arbitrary MEMS Perforation Problems with Edge and Rare Gas Effects |
| | T. Veijola and P. Raback |
| | Helsinki University of Technology, FI |
| - | Computer Aided Design and Optimization of Integrated Circuits with RF MEMS Devices by an ANN Based Macro-Modeling Approach |
| | Y. Lee, Y. Park, F. Niu, B. Bachman and D. Filipovic |
| | University of Colorado, US |
| - | Three Degrees of Freedom Thermal Microactuator |
| | A. Pasupuleti, F. Sahin, W.W. Walter, A. Raisanen, J.L. Hebding and K.D. Hirschman |
| | Rochester Institute of Technology, US |
| - | Computational Modeling of a Piezoelectrically Actuated Microvalve for the Control of Liquid Flowrate |
| | S.M. Saeidi, J.M. Khodadadi, C.A. Johnson, C. Lee and E-H Yang |
| | Auburn University, US |
| - | Effects of Etch Holes in Microelectromechanical Resonators |
| | J. Yan and A.A. Seshia |
| | University of Cambridge, UK |
| - | Electro-Static Membrane Model in CAD |
| | M. Zubert, M. Napieralska, A. Napieralski |
| | Department of Microelectronic and Computer Science, PL |
| - | Symbolic Finite Element Analysis for Parametric Studies |
| | R.W. Johnstone, T. Shimizu and M. Parameswaran |
| | Simon Fraser University, CA |
| - | Extraction of Damping Coefficients of Comb Drive by Partitioning |
| | A. Khaliq, X. Liu, R. Nohria, Y. Su and K. Varahramyan |
| | Louisiana Tech University, US |
| - | Modeling of an Electroactive Polyimide Ultrasonic Wave Sensor for Aerospace Applications |
| | W.C. Wilson, G.M. Atkinson, D.F. Perey, M.A. Scott and K.K. Tedjojuwono |
| | NASA LaRC, US |
| - | Numerical Investigation of Phase-Changing Heat Transfer for Laser-Assisted Direct Nano Imprint Processing |
| | F-B Hsiao, D-B Wang, C-P Jen, Y-C Lee and C-H Chuang |
| | National Cheng Kung University, TW |
| - | Stress Optimization of a Micromechanical Torsional Spring |
| | T. Klose, D. Kunze, T. Sandner, H. Schenk, H. Lakner, A. Schneider and P. Schneider |
| | Fraunhofer IPMS, DE |
| - | Optimization of GaAs MEMS structures for Microwave Power Sensor |
| | J. Jakovenko, M. Husak and T. Lalinsky |
| | Czech Technical University in Prague, CZ |
| - | Electromechanical Model for a Single Port Nano-Mechancial Beam Resonator |
| | T. Kemp, P.T. Docker, M.C.L. Ward and I.P. Jones |
| | The University of Birmingham, UK |
| - | Design of Experiment Tools for Process and Device Development |
| | N. Olij, A.F. Bakker and A.C.G. Nutt |
| | PhoeniX BV, NL |
| - | Combination of Analytical Models and Order Reduction Methods for System Level Modeling of Gyroscopes |
| | P. Schneider, S. Reitz, J. Bastian, P. Schwarz, C. Döring, M. Maute and R. Neul |
| | Fraunhofer Institute for Integrated Circuits, DE |
| - | Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis |
| | S. Holzer, Ch. Hollauer, H. Ceric, S. Wagner, R. Entner, E. Langer, T. Grasser and S. Selberherr |
| | Vienna University of Technology, AT |
| - | MEMS Pressure Sensor with Two Thin Film Piezoelectric Read-Out |
| | B. Sun and R. Zhang |
| | Cape Penisula University of Technology, SA |
| ISBN: | 0-9767985-2-2 |
| Pages: | 786 |
| Hardcopy: | $165.00 |
| Special: | 3 CD Set — 15% off with Free Shipping |
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