![]() | Nanotech 2005 Vol. 3
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
Chapter 9: MEMS Modeling and Design |
| - | Performance Tradeoffs in MEMS Sensors with High-Finesse Fabry-Perot Interferometry Detection |
| E.J. Eklund and A.M. Shkel | |
| University of California, Irvine, US | |
| - | A Coarse-Grained Tight Binding Method for Electrostatic Analysis of Nanoelectromechanical Systems (NEMS) |
| Y. Xu, G. Li and N.R. Aluru | |
| Beckman Institute for Advanced Science and Technology, US | |
| - | T-CAD Environment for Multi-Material-MEMS Design |
| U. Triltsch, S. Büttgenbach, D. Straube and H.-J. Franke | |
| Technical University of Braunschweig, DE | |
| - | Design, Modelling and Optimisation of Integrated Piezoelectric Micro Power Generators |
| M. Marzencki, S. Basrour and B. Charlot | |
| TIMA, FR | |
| - | A Robust Approach for Estimating Diffusion Constants from Concentration Data in Microchannel Mixers |
| C.P. Coelho, S. Desai, D. Freeman and J.K. White | |
| Massachusetts Institute of Technology, US | |
| - | Electromechanical Modeling of MEMS Resonators with MOSFET Detection |
| N. Abelé, V. Pott, K. Boucart, F. Casset, K. Séguéni, P. Ancey and A.M. Ionescu | |
| Swiss Federal Institute of Technology of Lausanne, CH | |
| - | Elastomeric Composites to Reduce the Effects of Trunnion Mode in Inertial Devices |
| Ma. Perez and A.M. Shkel | |
| University of California, Irvine, US | |
| - | A Method for Solving Arbitrary MEMS Perforation Problems with Edge and Rare Gas Effects |
| T. Veijola and P. Raback | |
| Helsinki University of Technology, FI | |
| - | Computer Aided Design and Optimization of Integrated Circuits with RF MEMS Devices by an ANN Based Macro-Modeling Approach |
| Y. Lee, Y. Park, F. Niu, B. Bachman and D. Filipovic | |
| University of Colorado, US | |
| - | Three Degrees of Freedom Thermal Microactuator |
| A. Pasupuleti, F. Sahin, W.W. Walter, A. Raisanen, J.L. Hebding and K.D. Hirschman | |
| Rochester Institute of Technology, US | |
| - | Computational Modeling of a Piezoelectrically Actuated Microvalve for the Control of Liquid Flowrate |
| S.M. Saeidi, J.M. Khodadadi, C.A. Johnson, C. Lee and E-H Yang | |
| Auburn University, US | |
| - | Effects of Etch Holes in Microelectromechanical Resonators |
| J. Yan and A.A. Seshia | |
| University of Cambridge, UK | |
| - | Electro-Static Membrane Model in CAD |
| M. Zubert, M. Napieralska, A. Napieralski | |
| Department of Microelectronic and Computer Science, PL | |
| - | Symbolic Finite Element Analysis for Parametric Studies |
| R.W. Johnstone, T. Shimizu and M. Parameswaran | |
| Simon Fraser University, CA | |
| - | Extraction of Damping Coefficients of Comb Drive by Partitioning |
| A. Khaliq, X. Liu, R. Nohria, Y. Su and K. Varahramyan | |
| Louisiana Tech University, US | |
| - | Modeling of an Electroactive Polyimide Ultrasonic Wave Sensor for Aerospace Applications |
| W.C. Wilson, G.M. Atkinson, D.F. Perey, M.A. Scott and K.K. Tedjojuwono | |
| NASA LaRC, US | |
| - | Numerical Investigation of Phase-Changing Heat Transfer for Laser-Assisted Direct Nano Imprint Processing |
| F-B Hsiao, D-B Wang, C-P Jen, Y-C Lee and C-H Chuang | |
| National Cheng Kung University, TW | |
| - | Stress Optimization of a Micromechanical Torsional Spring |
| T. Klose, D. Kunze, T. Sandner, H. Schenk, H. Lakner, A. Schneider and P. Schneider | |
| Fraunhofer IPMS, DE | |
| - | Optimization of GaAs MEMS structures for Microwave Power Sensor |
| J. Jakovenko, M. Husak and T. Lalinsky | |
| Czech Technical University in Prague, CZ | |
| - | Electromechanical Model for a Single Port Nano-Mechancial Beam Resonator |
| T. Kemp, P.T. Docker, M.C.L. Ward and I.P. Jones | |
| The University of Birmingham, UK | |
| - | Design of Experiment Tools for Process and Device Development |
| N. Olij, A.F. Bakker and A.C.G. Nutt | |
| PhoeniX BV, NL | |
| - | Combination of Analytical Models and Order Reduction Methods for System Level Modeling of Gyroscopes |
| P. Schneider, S. Reitz, J. Bastian, P. Schwarz, C. Döring, M. Maute and R. Neul | |
| Fraunhofer Institute for Integrated Circuits, DE | |
| - | Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis |
| S. Holzer, Ch. Hollauer, H. Ceric, S. Wagner, R. Entner, E. Langer, T. Grasser and S. Selberherr | |
| Vienna University of Technology, AT | |
| - | MEMS Pressure Sensor with Two Thin Film Piezoelectric Read-Out |
| B. Sun and R. Zhang | |
| Cape Penisula University of Technology, SA | |
| ISBN: | 0-9767985-2-2 |
| Pages: | 786 |
| Hardcopy: | $109.95 |
| Order: | Mail/Fax Form |
| Special: | 3 CD Set — 15% off with Free Shipping |
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