In-plane and Out-Of-Plane Mechanical Characterization of Thin Polysilicon

	Nanotech 2005 Vol. 3 Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3 Chapter 6: Characterization and Parameter Extraction
	In-plane and Out-Of-Plane Mechanical Characterization of Thin Polysilicon
Authors:	F. Cacchione, B. De Masi, A. Corigliano, M. Ferrera and A. Vinay
Affilation:	Politecnico di Milano, IT
Pages:	347 - 350
Keywords:	polysilicon, fracture, Weibull, on-chip test
Abstract:	In this paper is presented the mechanical characterization of thin polysilicon using different test structures. There are described two classes of on-chip test structures, with movement respectively in a plane parallel to the substrate and orthogonally to it. There are finally shown experimental results and the values obtained for Young's modulus and for rupture stringht. In this last case the results were obtained using the Weibull statistic.
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ISBN:	0-9767985-2-2
Pages:	786
Hardcopy:	$109.95

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