Nano Science and Technology Institute
Nanotech 2005 Vol. 3
Nanotech 2005 Vol. 3
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
 
Chapter 6: Characterization and Parameter Extraction
 

Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures

Authors:P. Szabo, G. Perlaky, Gy. Bognar, Gy. Horvath, S. Ress, A. Poppe, V. Szekely, M. Rencz and B. Courtois
Affilation:Budapest University of Technology and Economics, HU
Pages:331 - 334
Keywords:characterisation, testing, MEMS
Abstract:The paper will present a variety of possibilities for the thermal characterization of different movable MEMS devices and packaging. It will discuss the major difficulties in these methodologies and the ways to overcome them. Comparison of the different measurement techniques of movable Micro Electro Mechanical System (MEMS) devices and packages will be discussed as well. We will also present a methodology for the checking of the integrity of various MEMS structures by thermal transient measurements, enabling testing and diagnosis of these structures.
Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-StructuresView PDF of paper
ISBN:0-9767985-2-2
Pages:786
Hardcopy:$109.95
 
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