Characterization and Parameter Extraction

	Nanotech 2005 Vol. 3 Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3 Chapter 6: Characterization and Parameter Extraction
-	Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures
	P. Szabo, G. Perlaky, Gy. Bognar, Gy. Horvath, S. Ress, A. Poppe, V. Szekely, M. Rencz and B. Courtois
	Budapest University of Technology and Economics, HU
-	Application of MCLC Method for Estimating the Parameters of MEMS Sensors
	E. Colinet, J. Juillard and L. Nicu
	SUPELEC, FR
-	On the Determination of Thermal Expansion Coefficient of Thermal Oxide
	C. Tsou, Y.S. Huang and H.C. Chang
	Department of Automatic Control Engineering, Feng Chia University, TW
-	The Modeling and Characterization of Nano-Scale MOSFET Resistance
	J-H Lee, H-J Lee, W-H Lee, E-S Kang, J-Y Lee, K-R Byun, J-W Kang, H-J Hwang and O-K Kwon
	Sangmyung University, KR
-	In-plane and Out-Of-Plane Mechanical Characterization of Thin Polysilicon
	F. Cacchione, B. De Masi, A. Corigliano, M. Ferrera and A. Vinay
	Politecnico di Milano, IT
ISBN:	0-9767985-2-2
Pages:	786
Hardcopy:	$109.95

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