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 | Nanotech 2005 Vol. 3
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
Chapter 6: Characterization and Parameter Extraction |
| - | Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures | | | P. Szabo, G. Perlaky, Gy. Bognar, Gy. Horvath, S. Ress, A. Poppe, V. Szekely, M. Rencz and B. Courtois | | | Budapest University of Technology and Economics, HU |
| - | Application of MCLC Method for Estimating the Parameters of MEMS Sensors | | | E. Colinet, J. Juillard and L. Nicu | | | SUPELEC, FR |
| - | On the Determination of Thermal Expansion Coefficient of Thermal Oxide | | | C. Tsou, Y.S. Huang and H.C. Chang | | | Department of Automatic Control Engineering, Feng Chia University, TW |
| - | The Modeling and Characterization of Nano-Scale MOSFET Resistance | | | J-H Lee, H-J Lee, W-H Lee, E-S Kang, J-Y Lee, K-R Byun, J-W Kang, H-J Hwang and O-K Kwon | | | Sangmyung University, KR |
| - | In-plane and Out-Of-Plane Mechanical Characterization of Thin Polysilicon | | | F. Cacchione, B. De Masi, A. Corigliano, M. Ferrera and A. Vinay | | | Politecnico di Milano, IT |
| ISBN: | 0-9767985-2-2 |
| Pages: | 786 |
| Hardcopy: | $165.00 |
| Special: | 3 CD Set — 15% off with Free Shipping |
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| Order: | Mail/Fax Form |
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