 | Nanotech 2005 Vol. 3
Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
Chapter 4: Nano Scale Electronics Processing |
| - | Resolution Enhancement in Nanoimprinting by Surface Energy Engineering |
| | G.Y. Jung, W. Wu, Z. Li, S.Y. Wang, W.M. Tong and R.S. Williams |
| | Hewlett Packard Laboratories, US |
| - | Wafer Scale Aligned Sub-25nm Metal Nanowires on Silicon (110) using PEDAL Lift-off Process |
| | S.R. Sonkusale, C.J. Amsinck, D.P. Nackashi, N.H. Di Spigna, D. Barlage, M. Johnson and P.D. Franzon |
| | North Carolina State University, US |
| - | Self-Assembled Cluster Nanostructures and Nanodevices |
| | S.A. Brown, J. Partridge, S. Scott, R. Reichel, A. Ayesh and K.C. Tee |
| | Nano Cluster Devices Ltd, NZ |
| - | Aspect Ratio Improvement using the 2-step NERIME FIB Top Surface Imaging Process for Nano-lithography Applications |
| | K. Arshak, S.F. Gilmartin, D. Collins, O. Korostynska and A. Arshak |
| | University of Limerick and Analog Devices, IE |
| - | Low Voltage Electron Beam Lithography in PMMA |
| | M. Bolorizadeh and D.C. Joy |
| | University of Tennessee, US |
| - | Au Nano-Wire Transferring onto HSQ by Nano Imprinting Technology |
| | J.F. Liu, Y.J. Hsu, J.H. Chen, F.S. Huang and S.Z. Chen |
| | National Tsing Hua University, TW |
| - | Sub-100nm and Large Area Pattern Process using by Hybrid Nanocontact Printing (HnCP) |
| | J. Jo, K-Y Kim, D-S Choi and E-S Lee |
| | Korea Institute of Machinery & Materials(KIMM), KR |
| - | A Highly Reliable Pattern Transfer of Hydrogen Silsequioxane |
| | J.F. Liu, S.Z. Chen, H.J.H. Chen and F.S. Huang |
| | National Tsing Hua University, TW |
| - | Nanoscale Reaction Analysis of Resist Materials for Nanolithography |
| | T. Kozawa, A. Saeki, K. Okamoto and S. Tagawa |
| | Osaka University, JP |
| - | Nano Tungsten Silicide Thin Film Deposition and its Integration with Poly-Silicon |
| | M. Li and R. Suryanarayanan Iyer |
| | Applied Materials Inc., US |
| - | Resolution Enhancement in Nanoimprinting by Surface Energy Engineering |
| | G.Y. Jung, W. Wu, Z. Li, S.Y. Wang, W.M. Tong and R.S. Williams |
| | Hewlett Packard Laboratories, US |
| - | Wafer Scale Aligned Sub-25nm Metal Nanowires on Silicon (110) using PEDAL Lift-off Process |
| | S.R. Sonkusale, C.J. Amsinck, D.P. Nackashi, N.H. Di Spigna, D. Barlage, M. Johnson and P.D. Franzon |
| | North Carolina State University, US |
| - | Self-Assembled Cluster Nanostructures and Nanodevices |
| | S.A. Brown, J. Partridge, S. Scott, R. Reichel, A. Ayesh and K.C. Tee |
| | Nano Cluster Devices Ltd, NZ |
| - | Aspect Ratio Improvement using the 2-step NERIME FIB Top Surface Imaging Process for Nano-lithography Applications |
| | K. Arshak, S.F. Gilmartin, D. Collins, O. Korostynska and A. Arshak |
| | University of Limerick and Analog Devices, IE |
| - | Low Voltage Electron Beam Lithography in PMMA |
| | M. Bolorizadeh and D.C. Joy |
| | University of Tennessee, US |
| - | Au Nano-Wire Transferring onto HSQ by Nano Imprinting Technology |
| | J.F. Liu, Y.J. Hsu, J.H. Chen, F.S. Huang and S.Z. Chen |
| | National Tsing Hua University, TW |
| - | Sub-100nm and Large Area Pattern Process using by Hybrid Nanocontact Printing (HnCP) |
| | J. Jo, K-Y Kim, D-S Choi and E-S Lee |
| | Korea Institute of Machinery & Materials(KIMM), KR |
| - | A Highly Reliable Pattern Transfer of Hydrogen Silsequioxane |
| | J.F. Liu, S.Z. Chen, H.J.H. Chen and F.S. Huang |
| | National Tsing Hua University, TW |
| - | Nanoscale Reaction Analysis of Resist Materials for Nanolithography |
| | T. Kozawa, A. Saeki, K. Okamoto and S. Tagawa |
| | Osaka University, JP |
| - | Nano Tungsten Silicide Thin Film Deposition and its Integration with Poly-Silicon |
| | M. Li and R. Suryanarayanan Iyer |
| | Applied Materials Inc., US |
| ISBN: | 0-9767985-2-2 |
| Pages: | 786 |
| Hardcopy: | $165.00 |
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| Order: | Mail/Fax Form |
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