Authors: D. Yellowaga, J. Starzynski, B. Palmer, J. McFarland and S. Drews
Affilation: Honeywell, United States
Pages: 457 - 459
Keywords: wafer thinning, bulk silicon etch, texture etch, stress relief, wet etchants
Wet etchants can be used for the purpose of wafer thinning to meet die stacking and packaging requirements, stress relief when physical methods of thinning are used, as well as texturing to improve adhesion with back metal. It is possible to tune etchants to have different etch rates for silicon crystal orientation and doping concentration. Etchant composition also dictates surface finish of silicon, and etchants can be blended to delineate scratches and cracks in the wafer surface. The paper will discuss the effects of etchant blends and tool parameters on the etch rate and surface finish of silicon.