Authors: Q. Ji, X. Jianga, L. Jia, Y. Chena, B. van der Akker and K.-N. Leung
Affilation: Lawrence Berkeley National Laboratory, United States
Pages: 703 - 706
Keywords: focused ion beam, ion projection lithography, ion beam micromachining
The drive towards controlling materials properties at nanometer length scales relies on the availability of efficient tools. Ion beams have played a significant role in nanoscience and technology both in material modification (e. g., ion implantation) and analysis (e. g., secondary ion mass spectrometry). Currently, high resolution ion beam processing is limited to direct-write techniques with mostly gallium ion beams, or the use of pre-structured masks. Compact RF-driven ion sources have been developed for various ion species production, such as H+, He+, Ar+, O+, B+, P+ etc. They can also be employed to produce metallic ions, e.g. Cu+, Ni+, Cr+, Pd+, and molecular ions, e.g. C60+. Several novel ion beam systems have been developed based on this type of ion sources: Maskless Micro-Ion-Beam Reduction Lithography (MMRL) system, Multiple Focused Ion Beam (FIB) system and Ion Beam Imprinter, and a FIB/SEM dual beam system.