Compact Modeling for RF and Microwave Integrated Circuits

	WCM 2005 Technical Proceedings of the 2005 Workshop on Compact Modeling Chapter 4: WCM 2003 Invited Papers
	Compact Modeling for RF and Microwave Integrated Circuits
Authors:	A.M. Niknejad, M. Chan, C. Hu, B. Brodersen, J. Xi, J. He, S. Emami, C. Doan, Y. Cao, P. Su, H. Wan, M. Dunga and C.H. Lin
Affilation:	University of California at Berkeley, US
Pages:	339 - 342
Keywords:	RF, microwave, compact modeling, passive device, interconnect modeling, substrate coupling
Abstract:	Compact modeling has been an integral part of the design of integrated circuits for digital and analog applications. The availability of scalable CMOS device models has enabled rapid simulation and design of present and future device technologies. Increasingly RF and microwave circuits designed with CMOS and SiGe technologies obviate the need for compact modeling in this domain. In this paper we will summarize the unique requirements of high-frequency compact modeling efforts by focusing on key components, such as passive devices, interconnect, substrate coupling and active devices.
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ISBN:	0-9767985-3-0
Pages:	412
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