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 | Nanotech 2004 Vol. 3
Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 3
Chapter 3: Atomic and Mesoscale Modelling of Nanoscale Phenomena |
| | Design and Development of Nano-reinforced Bonds and Interfaces | | Authors: | Y. Sun, S.A. Meguid, K.M. Liew and L.S. Ong | | Affilation: | University of Toronto, CA | | Pages: | 126 - 129 | | Keywords: | nano-reinforced interfaces, carbon nanotubes, Aliumina nanopowder, mechanical behaviour, delamination, energy release rate, hybrid strutures | | Abstract: | This investigation focuses on the design and development of nano-reinforced adhesively-bonded high performance joints. The influence of homogeneous dispersion of carbon nanotubes and alumina nanoparticles on the cohesive strength, interfacial properties and mechanical behaviour of epoxy adhesives is examined. Mechanical tests and optical measurements are conducted, using carbon fibre/epoxy laminate and aluminium alloy adherends with high performance epoxy adhesives, to evaluate the optimum weight percentage of the nanofillers to be added to induce maximum enhancement in strength and strain energy release rate. The results reveal that the introduction of nanofillers into the epoxy adhesive leads to a dramatic improvement in the debonding and shear strength of the interface without sacrificing its toughness. The presence of nanoparticles plays a major role in determining the fracture toughness of the interface and is typically associated with a significant improvement in the delamination resistance of the joint. | | ISBN: | 0-9728422-9-2 |
| Pages: | 561 |
| Hardcopy: | $150.00 |
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