Authors: Y. Wang, F. Duewer, S. Kamath, D. Scott and W. Yun
Affilation: Xradia, Inc., United States
Pages: 503 - 507
Keywords: microtomography, IC packaging
X rays is ideally suited for non-destructively imaging micrometer and nanometer sized structures because of its large penetration depth and rich contrast mechanisms. In particular, projection-type x-ray microscopes are widely used in material science and semiconductor industries. The resolution of these system is typically determined by the size of the x-ray source. Consequently, a small x-ray source size and high magnification are required to achieve high resolution, and a compromise between the resolution and the throughput must be made. Xradia’s microXCT projection imaging system resolves this compromise by using a unique optical design. It is able to acquire images with 1-micormeter resolution in an exposure time of a few seconds. Lower resolution images can be acquired in real time. This instrument includes fully automated tomographic data acquisition and reconstruction capability for an user to study the 3D structure of a sample with little need of operator intervention. An interactive visualization software then allows the user to view and analyze the 3D data in various ways, including 3D rendering and virtual sections. This system’s unique capability of imaging at high-resolution without compromising the throughput makes it a powerful tool in non-destructive imaging applications in microtechnology and biotechnology, for example, integrated circuits packaging failure analysis, imaging embedded MEMs structures, material stress failure mode analysis.