Nanotech 2004 Vol. 3
Nanotech 2004 Vol. 3
Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 3

Micro and Nano Structuring and Assembly Chapter 10

Nano-Structured C60-SAM Formed on Ultrathin Au Films/MgO Single Crystal
H. Yamamoto, N. Iwata and Y. Shimizu
Nihon University, College of Science & Technology, JP

Single-Dot Spectroscopy of Low Density GaAs Quantum Dots Grown by Modified Droplet Epitaxy
M. Yamagiwa, F. Minami and N. Koguchi
Tokyo Institute of Technology, JP

Self-assembled Alternating Nano-scaled Layers
W-Y Wu and J-M Ting
National Cheng Kung University, TW

Fabrication of Metallic Nano-stamper and Replication of Nano-patterned Substrate for Patterned Media
Y. Kim, N. Lee, Y-J Kim and S. Kang
Yonsei University, KR

Nano-Lithography in Ultra-High Vacuum (UHV) for Real World Applications
J. Gilsinn, H. Zhou, B. Damazo, J. Fu and R. Silver
NIST, US

Investigation of Tooling Surfaces on Injection Molded Nanoscale Features
S-H Yoon, C. Srirojpinyo, J. Lee, C. Sung, J.L. Mead and C.M.F. Barry
University of Massachusetts at Lowell, US

Processing Parameters Affecting Nanoinjection Molding
C. Srirojpinyo, S-H Yoon, J. Lee, C. Sung, J.L. Mead and C.M.F. Barry
University of Massachusetts Lowell, US

Interfacial Instabilities in Multilayer Extrusion
K. Ho, J.S. Lee, N. Viriyabanthorn, C. Sung, C.M.F. Barry and J.L. Mead
University of Massachusetts Lowell, US

Microcap Selective Packaging through Flip Chip Alignment
C.H. Chao and C.T. Pan
National Sun Yat-Sen University, TW


ISBN: 0-9728422-9-2
Pages: 561
Hardcopy: $79.95

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