 | Nanotech 2004 Vol. 3
Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 3
Chapter 1: Nano Photonics, Optoelectronics and Imaging |
High Resolution Backside Imaging and Thermography using a Numerical Aperature Increasing Lens | |
| Authors: | M.S. Ünlü, S.B. Ippolito, M.G. Eraslan, S.A. Thorne, A. Vamivakas, B.B. Goldberg and Y. Leblebici |
| Affilation: | Boston University, US |
| Pages: | 8 - 10 |
| Keywords: | thermal imaging, high-resolution, failure analysis, solid immersion lens |
| Abstract: | Nanoscale imaging of defects in ICs is a great current technological challenge as IC feature sizes continue to shrink. We have developed novel techniques based on a Numerical Aperture Increasing Lens (NAIL) to study semiconductors at very high spatial resolution. The NAIL is placed on the surface of a sample and its convex surface effectively transforms the NAIL and the planar sample into an integrated solid immersion lens. Addition of the NAIL to a standard microscope increases the NA by a factor of square of the index n, to a maximum of NA = n. In silicon, the NA is increased by a factor of 13, to NA = 3.6. The spatial resolution improvement laterally is about a factor of 4 while longitudinally it is a factor of 12.5 corresponding to an overall reduction of the volume of interrogation by a factor of 50. Subsurface solid immersion microscopy can be applied to thermal imaging of blackbody radiation at IR wavelengths. We have designed, built, and demonstrated the use of a subsurface solid immersion microscope with capability for confocal imaging in 3-5µm wavelength range and demonstrated a resolution of 1.4µm, representing the highest resolution subsurface thermography to date. |
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| ISBN: | 0-9728422-9-2 |
| Pages: | 561 |
| Hardcopy: | $79.95 |
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