Authors: A. Atre and S. Boedo
Affilation: Rochester Institute of Technology, United States
Pages: 263 - 266
Keywords: thermal microactuators, finite element analysis, thermal conductivity, ANSYS
Electrically heated, thermally driven, surface micromachined polysilicon beam flexure thermal actuators have been investigated using analytical methods that employ constant material properties either taken at room temperature or based on a set of averaged temperatures over the device operational range. In this paper, we present a comprehensive finite element analysis approach to examine the relative importance of temperature dependent material properties of heavily doped polysilicon on the static response of thermal actuator systems in air and vacuum environments. The results of the comprehensive analysis, which includes conduction, convection, and radiation, are validated by comparing the predicted actuator deflection to that obtained experimentally.