Nanotech 2004 Vol. 2
Nanotech 2004 Vol. 2
Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 2

MEMS Modeling Chapter 6

A Model for Thermoelastic Damping in Microplates

Authors: A.H. Nayfeh and M.I. Younis

Affilation: Virginia Tech, United States

Pages: 255 - 258

Keywords: Microplates, thermoelastic damping, electrostatic forces, quality factors

Abstract:
We present a model and analytical expressions for the quality factors of microplates due to thermoelastic damping. We solve the heat equation for the thermal current across the thickness of a microplate, and hence decouple the thermal equation from the plate equation. We utilize a perturbation method to derive an analytical expression for the quality factor of microplates, of general boundary conditions under electrostatic loading and residual stresses, in terms of their structural mode shapes. For the special case of no electrostatic and in-plane loadings, we derive a simple analytical expression for the quality factor, which is independent of the mode shapes. We verify the model by comparing the calculated quality factors of the special case of microbeams to theoretical results obtained using the microbeam models in the literature. We present several results for various modes of microplates with various boundary conditions.


ISBN: 0-9728422-8-4
Pages: 519
Hardcopy: $79.95

2015 & Newer Proceedings

Nanotech Conference Proceedings are now published in the TechConnect Briefs

NSTI Online Community