Authors: J. Sin, W.H. Lee and H.E. Stephanou
Affilation: RPI, United States
Pages: 271 - 274
Keywords: micropump, electrothermal, modeling, power, optimization
This paper presents the fabrication, analysis and optimization of a novel monolithically fabricated diaphragm micropump, referred to as an in-plane micropump. Compared to previous technology, the micropump in this paper is fabricated to have all necessary components in a single silicon layer. The actuation principle is electrothermal expansion of a silicon V-beam, and its expansion is amplified through a lever structure to create a greater diaphragm stroke. Either a check valve or a diffuser is incorporated with a diaphragm to direct fluid flow. The Deep RIE (Reactive Ion Etching) process is used to fabricate the pump structure on a SOI (Silicon On Insulator) wafer, and the electromechanical property of the pump structure is characterized to estimate the pump's performance. Considering that minimization of energy consumption is one of the critical design objectives in micropumps, the design parameters of the pump structure are optimized for minimal driving power.