Authors: M. Wang, K-Y Weng, C-C Huang, W-P Liu and L-Y Yao
Affilation: Industrial Technology Research Institute, Taiwan
Pages: 192 - 194
Keywords: polymer chip, thermal bonding, micromold
Polymer is well suited as a substrate for bio-application devices due to its high dielectric constant, bio-compatible, low cost and ease of microfabrication. The primary goal is the successful fabrication of microchannels for biochip commonly used in genomics and proteomics. A possible solution is polymer hot embossing. Coupled with the hydrophobic nature and clear optical properties make it promising material for bio-analytical microdevices. The research is to develop a procedure for hot embossing of the microfluidic devices on PC substrate, and a method for thermal bonding to seal an embossed polymer substrate with a hole-drilled polymer wafer.