Nanotech 2004 Vol. 1
Nanotech 2004 Vol. 1
Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 1

Micro and Nano Structuring and Assembly Chapter 10

A Novel Method for Determining Optimum Etch Times for the One Step Dry Release Proces

Authors: P.T. Docker, P.K. Kinnell and M.C. Ward

Affilation: The University of Birmingham, United Kingdom

Pages: 469 - 472

Keywords: DRIE, Dry release process, STS etching, SOI wafers, Released structures

Abstract:
This paper details a novel method for determining the optimum etch times for releasing structures when using the authors one step dry release process. By using self releasing structures known as waffles the exact point when a device is released can be determined without having to etch numerous chips for different times and sectioning them. This solution allows a worker to determine when a device is released by a simple visual check.

A Novel Method for Determining Optimum Etch Times for the One Step Dry Release Proces

ISBN: 0-9728422-7-6
Pages: 521
Hardcopy: $79.95