Nanotech 2003 Vol. 2
Nanotech 2003 Vol. 2
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2

MEMS Design and Application Chapter 9

Design and fabrication of an integrated CMOS-MEMS 3-axis accelerometer

Authors: H. Xie, G.K. Fedder, Z. Pan and W. Frey

Affilation: University of Florida, United States

Pages: 420 - 423

Keywords: CMOS-MEMS, accelerometer, 3-axis

Abstract:
This paper reports a novel single structure, three-axis sensing accelerometer based on post-CMOS process. The resultant device incorporates both thin-film structures and bulk Si structures to achieve three-axis acceleration sensing without extra front-side lithography, or wafer bonding, which are required by other CMOS three-axis accelerometers. Behavioral simulation using NODAS and FEM simulation were used to validate the design. The overall structure size is about 1mm by 1mm. Noise floor of 0.1 mG/rtHz is expected in all three axes. Characterization is ongoing.

Design and fabrication of an integrated CMOS-MEMS 3-axis accelerometer

ISBN: 0-9728422-1-7
Pages: 600