Nanotech 2003 Vol. 2
Nanotech 2003 Vol. 2
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2

Compact Modeling Chapter 7

Compact Modeling for RF and Microwave Integrated Circuits

Authors: A.M. Niknejad, M. Chan, C. Hu, B. Brodersen, J. Xi, J. He, S. Emami, C. Doan, Y. Cao, P. Su, H. Wan, M. Dunga and C.H. Lin

Affilation: University of California at Berkeley, United States

Pages: 294 - 297

Keywords: RF, microwave, compact modeling, passive device, interconnect modeling, substrate coupling

Abstract:
Compact modeling has been an integral part of the design of integrated circuits for digital and analog applications. The availability of scalable CMOS device models has enabled rapid simulation and design of present and future device technologies. Increasingly RF and microwave circuits designed with CMOS and SiGe technologies obviate the need for compact modeling in this domain. In this paper we will summarize the unique requirements of high-frequency compact modeling efforts by focusing on key components, such as passive devices, interconnect, substrate coupling and active devices.

Compact Modeling for RF and Microwave Integrated Circuits

ISBN: 0-9728422-1-7
Pages: 600