Nanotech 2003 Vol. 2
Nanotech 2003 Vol. 2
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2

System Level Modeling Chapter 11

Lumped Modeling of Thermal Inkjet Print Head

Authors: Y-S Lee, M.S. Kim, S. Shin and S.J. Shin

Affilation: CSE Center, Samsung Advanced Institute of Technology, Korea

Pages: 488 - 491

Keywords: thermal inkjet print head, lumped modeling, equivalent circuit

Abstract:
A lumped model is developed to improve the design of a thermally driven monolithic inkjet print head. The model is based on a two-dimensional heat conduction equation, an empirical pressure-temperature relation and a hydraulic flow-pressure equation. It has been simulated through the construction of an equivalent electronic circuit, and subsequently analysed using SIMULINK and a circuit simulation tool, PLECS. Using the model, efficient heater structures for a better heat treatment are proposed and validated with experimental results. Futhermore, the effects of the head geometry on drop ejection and refill of ink are analysed using the one-dimensional hydraulic model including nonlinear flow resistances.

Lumped Modeling of Thermal Inkjet Print Head

ISBN: 0-9728422-1-7
Pages: 600