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 | Nanotech 2003 Vol. 2
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2
Chapter 11: System Level Modeling |
| | Lumped Modeling of Thermal Inkjet Print Head | | Authors: | Y-S Lee, M.S. Kim, S. Shin and S.J. Shin | | Affilation: | CSE Center, Samsung Advanced Institute of Technology, KR | | Pages: | 488 - 491 | | Keywords: | thermal inkjet print head, lumped modeling, equivalent circuit | | Abstract: | A lumped model is developed to improve the design of a thermally driven monolithic inkjet print head. The model is based on a two-dimensional heat conduction equation, an empirical pressure-temperature relation and a hydraulic flow-pressure equation. It has been simulated through the construction of an equivalent electronic circuit, and subsequently analysed using SIMULINK and a circuit simulation tool, PLECS. Using the model, efficient heater structures for a better heat treatment are proposed and validated with experimental results. Futhermore, the effects of the head geometry on drop ejection and refill of ink are analysed using the one-dimensional hydraulic model including nonlinear flow resistances. |  | View paper | | ISBN: | 0-9728422-1-7 |
| Pages: | 600 |
| Hardcopy: | $125.00 |
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