Nano Science and Technology Institute
Nanotech 2003 Vol. 2
Nanotech 2003 Vol. 2
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2
Chapter 11: System Level Modeling

Lumped Modeling of Thermal Inkjet Print Head

Authors:Y-S Lee, M.S. Kim, S. Shin and S.J. Shin
Affilation:CSE Center, Samsung Advanced Institute of Technology, KR
Pages:488 - 491
Keywords:thermal inkjet print head, lumped modeling, equivalent circuit
Abstract:A lumped model is developed to improve the design of a thermally driven monolithic inkjet print head. The model is based on a two-dimensional heat conduction equation, an empirical pressure-temperature relation and a hydraulic flow-pressure equation. It has been simulated through the construction of an equivalent electronic circuit, and subsequently analysed using SIMULINK and a circuit simulation tool, PLECS. Using the model, efficient heater structures for a better heat treatment are proposed and validated with experimental results. Futhermore, the effects of the head geometry on drop ejection and refill of ink are analysed using the one-dimensional hydraulic model including nonlinear flow resistances.
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