Lumped Modeling of Thermal Inkjet Print Head

	Nanotech 2003 Vol. 2 Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2 Chapter 11: System Level Modeling
	Lumped Modeling of Thermal Inkjet Print Head
Authors:	Y-S Lee, M.S. Kim, S. Shin and S.J. Shin
Affilation:	CSE Center, Samsung Advanced Institute of Technology, KR
Pages:	488 - 491
Keywords:	thermal inkjet print head, lumped modeling, equivalent circuit
Abstract:	A lumped model is developed to improve the design of a thermally driven monolithic inkjet print head. The model is based on a two-dimensional heat conduction equation, an empirical pressure-temperature relation and a hydraulic flow-pressure equation. It has been simulated through the construction of an equivalent electronic circuit, and subsequently analysed using SIMULINK and a circuit simulation tool, PLECS. Using the model, efficient heater structures for a better heat treatment are proposed and validated with experimental results. Futhermore, the effects of the head geometry on drop ejection and refill of ink are analysed using the one-dimensional hydraulic model including nonlinear flow resistances.
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ISBN:	0-9728422-1-7
Pages:	600
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