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 | Nanotech 2003 Vol. 1
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 1
Chapter 13: Wafer and MEMS Processing |
| | Process for Extremely Thin Silicon-on-Insulator Wafer | | Authors: | A.Y. Usenko, W.N. Carr and B. Chen | | Affilation: | Silicon Wafer Technologies, Inc., US | | Pages: | 546 - 551 | | Keywords: | SOI, hydrogen, silicon, implantation, platelets, plasma | | Abstract: | We observe hydrogen platelets buildup into single crystalline silicon caused by hydrogen plasma processing. The platelets are aligned along a layer of lattice defects formed in silicon before plasma processing. The buried defect layer is formed by either silicon-into-silicon or argon-into-silicon implantation. We discuss the platelet nucleation, growth, and merge phenomena, and discuss applicability of the plasma hydrogenation to silicon-on-insulator wafer process of layer transfer type. |  | View paper | | ISBN: | 0-9728422-0-9 |
| Pages: | 560 |
| Hardcopy: | $125.00 |
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