Authors: R.J. Gutmann, J-Q Lu, J.J. McMahon, P.D. Persans, T.S. Cale, E.T. Eisenbraun, J. Castracane and A.E Kaloyeros
Affilation: Rensselaer Polytechnic Institute, United States
Pages: 530 - 533
Keywords: heterogeneous integration, 3D ICs, 3D Integration, wafer bonding, high density multifunctional integration, HDMI
A technology platform -wafer-scale high density multifunctional integration (HDMI) -is described which offers the potential for low-cost integration of information processing and sensor/actuator technologies for future microelectronic, nanoelectronic, mixed electro-optical and bio-molecular systems. The HDMI based upon three-dimensional (3D) wafer-level integration scheme alleviates processing constraints associated with system-on-chip (SoC) electronic integration, while providing the capability of extension to opto-electronic, bio-molecular and other heterogeneous applications, including sensors and actuators. In this presentation the technology platform will be described, status of the process development results obtained to date discussed and approaches to heterogeneous integration outlined. A package assembly envisioned to such HDMI implementations will be discussed, which includes a high density of input/output (I/O) contacts using flip-chip solder bumps or sea-of-leads contacts to a thin film structure.