MSM 99
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems

Software Tools, CAD Systems Chapter 9

Modeling of Stress Induced Hysteresis in Piezo-Resistive Analysis

Authors: H.-P. Lien

Affilation: ISE, Switzerland

Pages: 338 - 341

Keywords: piezo-resistivity, stress compensation, technology CAD, integrated simulation environment

Abstract:
The impact of mechanical stress on electrical characterizations of microelectronic circuitry is a major design issue in development of sensors and integrated micro-electro-mechanical systems. Because the electrical properties of semiconductors are in uenced by external and thermally induced mechanical stress, the magnitude of such effects should be analyzed during the design process. Such non-linear and hysteresis effects can be modeled and analyzed using state-of-the-art technology CAD (TCAD) tools, providing information about device characteristics prior to production.

Modeling of Stress Induced Hysteresis in Piezo-Resistive Analysis

ISBN: 0-9666135-4-6
Pages: 697