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 | MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Chapter 7: Equivalent Circuits, Behavioral and Multilevel Simulation |
| | Partial-Element Equivalent-Circuit Model Simulation for Designing RF-Wireless Communication Products with Embedded Passive Components | | Authors: | W.R. Smith | | Affilation: | National Semiconductor Corporation, U.S.A. | | Pages: | 222 - 227 | | Keywords: | RF/wireless communication, device and circuit simulation, boundary-element method, CAD, LTCC | | Abstract: | Rapidly increasing functionality and performance of RF/wireless communication products, along with mandated decreases in size, weight, and cost, have created a critical need to replace discrete, surface-mounted passive circuit components with embedded passives in substrate technologies such as Low-Temperature Cofired Ceramic (LTCC). The design process for embedded passives requires rapid electromagnetic simulation with full mutual coupling among all embedded structures, to allow each design-refining iteration to be carried out in a few minutes. Full-wave '2.5-D planar' solvers perform the right type of simulation, but typically require run times of hours to days and sometimes cannot accommodate the required circuit/layout complexity. In order to achieve results of comparable accuracy in the RF/wireless frequency range, with simulation times of a few minutes, we have used the well-known Partial-Element Equivalent-Circuit (PEEC) modeling technique to develop a simulator that is used in the same way as existing multi-layer planar solvers. |  | View paper | | ISBN: | 0-9666135-4-6 |
| Pages: | 697 |
| Hardcopy: | $100.00 |
| Special: | 3 CD Set — 15% off with Free Shipping |
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