MSM 99
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems

Characterization, Parameter Extraction, Calibration Chapter 6

IMAP: Interferometry for Material Property Measurement in MEMS

Authors: B.D. Jensen, M.P. de Boer and S.L. Miller

Affilation: Sandia National Laboratory, United States

Pages: 206 - 209

Keywords: optical measurement, material properties, interferometry

An interferometric technique has been developed for non-destructive, high-confidence, in-si tu determination of material properties in MEMS. By using interferometry to measure the full deflection curves of beams pulled toward the substrate under electrostatic loads, the actual behavior of the beams has been modeled. No other method for deter-mining material properties allows such detailed knowledge of device behavior to be gathered. Values for material properties and non-idealities (such as support post compliance) have then been extracted which minimize the error between the measured and modeled deflections. High accuracy and resolution have been demonstrated, allowing the measurements to be used to enhance process control.

IMAP: Interferometry for Material Property Measurement in MEMS

ISBN: 0-9666135-4-6
Pages: 697