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 | MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Chapter 6: Characterization, Parameter Extraction, Calibration |
| | Simple ADPL Implementation of a 3D FEM Simulator for Mutual Capacitances of Arbitrarily Shaped Objects Like Interconnects | | Authors: | A. Hieke | | Affilation: | Siemens Microelectronics, U.S.A. | | Pages: | 172 - 175 | | Keywords: | capacitance simulation, 3D FEM, Interconnect, ANSYS, APDL | | Abstract: | This paper describes the implementation of an ANSYS Parametric Design Language (APDF) macro called CACACO for the computation of capacitance matrixes of arbitrarily shaped 3D objects in arbitrarily distributed dielectrics via the conservation of field energies. APDL, as the interface language of the general purpose FEM system ANSYS-Multiphysice provides an exceptional high-level of abstraction and enables the realization with acceptabe effort. The most significant advantabe of the described implementation is the utilization of the advanced 3D capabilities of ANSYS to generate, edit and visualize realistically shaped (non-Manhattan) 3D structures either by parametric description and/or graphical interaction (e.g. spaceball, VRML models, etc.) exceeding known soltion. These features are especially helpful for initial principal design studies of potential structures. One typical application of CAMACO is the computation of capacitance matrixes for parasitic elements in DRAM memory cells. A 3D multi-level metal interconnect capacitance analysis of a potential trench capacitor 1GBit DRAM cell in 150nm minimum feature size is discussed. |  | View paper | | ISBN: | 0-9666135-4-6 |
| Pages: | 697 |
| Hardcopy: | $100.00 |
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