 | MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Chapter 17: Applications: Pressure, Actuation, Navigation |
Simulation of the Production of Functional Layers for Vibration Sensors for Tool State Monitoring and Finite Element Analysis of Mechanical Characteristics | |
| Authors: | J. Thomas, R. Kühnhold, R. Schnupp, G. Temmel, H. Ryssel |
| Affilation: | Fraunhofer-Institut fur Integrierte Schaltungen, DE |
| Pages: | 593 - 596 |
| Keywords: | vibration sensor, polysilicon, sensitivity, resonance frequency, design optimization |
| Abstract: | A novel MEMS vibration sensor for high acceleration am-plitudes was developed in silicon technology for tool state monitoring. According to the application-specific require-ments, the piezoresistive detection of vibration with polysilicon piezoresistors deposited on a thin silicon mem-brane is best suited. The technological parameters for the production of these strain-sensitive components were deter-mined by ICECREM, a simulation program for processing steps in semiconductor production. The vibration character-istics, i.e. sensitivity, range, and resonance frequency, were predicted by analyzes with the Finite Element Method. Thus, design optimization for an optimum mechanical performance was executed. The sensor was manufactured by a CMOS compatible process. The measured sensitivity of over 20µV/Vg corresponds well with the simulation re-sults, given the deviations of the sensor shape from the simulated values caused during the production process, and represents the highest known for this working range. |
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| ISBN: | 0-9666135-4-6 |
| Pages: | 697 |
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