MSM 99
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems

Applications: Pressure, Actuation, Navigation Chapter 17

Simulation of the Production of Functional Layers for Vibration Sensors for Tool State Monitoring and Finite Element Analysis of Mechanical Characteristics

Authors: J. Thomas, R. Kühnhold, R. Schnupp, G. Temmel, H. Ryssel

Affilation: Fraunhofer-Institut fur Integrierte Schaltungen, Germany

Pages: 593 - 596

Keywords: vibration sensor, polysilicon, sensitivity, resonance frequency, design optimization

Abstract:
A novel MEMS vibration sensor for high acceleration am-plitudes was developed in silicon technology for tool state monitoring. According to the application-specific require-ments, the piezoresistive detection of vibration with polysilicon piezoresistors deposited on a thin silicon mem-brane is best suited. The technological parameters for the production of these strain-sensitive components were deter-mined by ICECREM, a simulation program for processing steps in semiconductor production. The vibration character-istics, i.e. sensitivity, range, and resonance frequency, were predicted by analyzes with the Finite Element Method. Thus, design optimization for an optimum mechanical performance was executed. The sensor was manufactured by a CMOS compatible process. The measured sensitivity of over 20µV/Vg corresponds well with the simulation re-sults, given the deviations of the sensor shape from the simulated values caused during the production process, and represents the highest known for this working range.

Simulation of the Production of Functional Layers for Vibration Sensors for Tool State Monitoring and Finite Element Analysis of Mechanical Characteristics

ISBN: 0-9666135-4-6
Pages: 697