Nano Science and Technology Institute
MSM 99
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
 
Chapter 14: Yield and Reliability
 

Numerical Fracture Analysis of MEMS Devices

Authors:N. Tayebi and A.K. Tayebi
Affilation:Case Western Reserve University, US
Pages:491 - 494
Keywords:linear elastic fracture mechanics, MEMS reliability, numerical methods, meshless methods, boundary element methods
Abstract:Non-conventional finite element analysis (FEA) based on linear elastic fracture mechanics (LEFM) is applied to fractured MEMS specimens with notches. The objective of this paper is to test the applicability of LEFM at mesoscale and to evaluate the application of newly developed FEA methods to MEMS fracture analysis. The displacement discontinuity method and the element free Galerking meshless method are used. The tested cases consisted of specimens in the form of notched cantilever beams, and double cantilever beams suspended by an anchor by two thin beams. A good correlation with some experiments is obtained.
Numerical Fracture Analysis of MEMS DevicesView PDF of paper
ISBN:0-9666135-4-6
Pages:697
Up
© 2014 Nano Science and Technology Institute. All Rights Reserved.
Terms of Use | Privacy Policy | Contact Us | Site Map