Nano Science and Technology Institute
MSM 99
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Chapter 14: Yield and Reliability

Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules

Authors:S. Ramminger, G. Mitic, P. Türkes and G. Wachutka
Affilation:Siemens AG, DE
Pages:483 - 486
Keywords:wire bonding, power electronics, thermo-mechanical simulation, failure analysis, IGBT, reliability
Abstract:High voltage and high current power modules are key components for traction applications. In the future, railway locomotives, tramways and elevators will be equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this field of application high reliability is of decisive importance, especially for aluminum bond wires with diameters up to 500 µm, connecting the silicon device with the output pins. Reliability tests show that wire bonding and soldering may cause failures of the modules. In this work, we investigate the stress and strain distributions in the bonding zone after a temperature load step using finite-element analysis.
Thermo-Mechanical Simulation of Wire Bonding Joints in Power ModulesView PDF of paper
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