Nano Science and Technology Institute
MSM 99
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems

Chapter 14:

Yield and Reliability

-A Simple VLSI Spherical Particle-Induced Yield Predictor
 K. Nakamae, H. Ohmori and H. Fujioka
 Osaka University, JP
-Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules
 S. Ramminger, G. Mitic, P. Türkes and G. Wachutka
 Siemens AG, DE
-Strength Prediction for MEMS Components Transferring Large Loads
 L-H. Chu, Q. Chen and G.P. Carman
 University of California, Los Angeles, US
-Numerical Fracture Analysis of MEMS Devices
 N. Tayebi and A.K. Tayebi
 Case Western Reserve University, US
-Rapid Reliability Assessment Using CADMP-II
 F.P. McCluskey and M. Pecht
 University of Maryland, US
-Inductive Fault Analysis of a Microresonator
 T. Jiang, C. Kellon and R.D. Blanton
 Carnegie Mellon University, US
ISBN:0-9666135-4-6
Pages:697
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