Yield and Reliability

	MSM 99 Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems Chapter 14: Yield and Reliability
-	A Simple VLSI Spherical Particle-Induced Yield Predictor
	K. Nakamae, H. Ohmori and H. Fujioka
	Osaka University, JP
-	Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules
	S. Ramminger, G. Mitic, P. Türkes and G. Wachutka
	Siemens AG, DE
-	Strength Prediction for MEMS Components Transferring Large Loads
	L-H. Chu, Q. Chen and G.P. Carman
	University of California, Los Angeles, US
-	Numerical Fracture Analysis of MEMS Devices
	N. Tayebi and A.K. Tayebi
	Case Western Reserve University, US
-	Rapid Reliability Assessment Using CADMP-II
	F.P. McCluskey and M. Pecht
	University of Maryland, US
-	Inductive Fault Analysis of a Microresonator
	T. Jiang, C. Kellon and R.D. Blanton
	Carnegie Mellon University, US
ISBN:	0-9666135-4-6
Pages:	697
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