MSM 99
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems

Metallization Modeling Chapter 13

Modeling Nucleation and Growth of Voids During Electromigration

Authors: D. Richards, J.B. Adams and L.J. Borucki

Affilation: Arizona State University, United States

Pages: 471 - 474

Keywords: electromigration, void nucleation, void growth

Abstract:
We calculate the formation energy of small voids in Al and Cu, both at the bulk and at grain boundaries, using the Embedded Atom Method. Then, we use those results as input to a Kinetic Monte Carlo model of void nucleation and growth in Al interconnects. Preliminary test cases of the Monte Carlo model are discussed.

Modeling Nucleation and Growth of Voids During Electromigration

ISBN: 0-9666135-4-6
Pages: 697