Authors: D. Richards, J.B. Adams and L.J. Borucki
Affilation: Arizona State University, United States
Pages: 471 - 474
Keywords: electromigration, void nucleation, void growth
We calculate the formation energy of small voids in Al and Cu, both at the bulk and at grain boundaries, using the Embedded Atom Method. Then, we use those results as input to a Kinetic Monte Carlo model of void nucleation and growth in Al interconnects. Preliminary test cases of the Monte Carlo model are discussed.