 | MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Chapter 13: Metallization Modeling |
| | TopoSim3D/Grain3D: Modeling Surface Deposition and Growth |
| Authors: | J.T. Gammel and R. Walker |
| Affilation: | Los Alamos National Laboratory, U.S.A. |
| Pages: | 452 - 454 |
| Keywords: | grain growth, moving finite elemtns, deposition models, simulation tools |
| Abstract: | We discuss the coupling we are develping between TopoSim3D and Grain3D - two tols making use of the Los Alamos LaGriT adaptive grid toolset. TopoSim3D is a three-dimensional profile simulation tool being developed at Los Alamos to model surface motion during deposition and etc, with the surface reaction mechanisms described using ChemKin and Surface ChemKin software libraries, developed at Sandia National Laboratory. Grain3D is a three-dimensional Gradient Weighted Moving Finite Element code being developed at Los Alamos to model microstructural evolution and annealing. Coupling these two tools provides a capability for studying three-dimensional effects during processing at a feature-scale level. |
| ISBN: | 0-9666135-4-6 |
| Pages: | 697 |
| Hardcopy: | $100.00 |
| Special: | 3 CD Set — 15% off with Free Shipping |
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