 | MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Chapter 13: Metallization Modeling |
| - | Numerical Simulations of Sputter Deposition and Etching in Trenches Using the Level Set Technique |
| | P.L. O'Sullivan, F.H. Baumann and G.H. Gilmer |
| | Bell Laboratories, Lucent Technologies, US |
| - | TopoSim3D/Grain3D: Modeling Surface Deposition and Growth |
| | J.T. Gammel and R. Walker |
| | Los Alamos National Laboratory, US |
| - | Modeling Facet Growth of Cu Thin Films |
| | Z. Wang, Y. Li and J.B. Adams |
| | Arizona State University, US |
| - | Computational Modeling with a New Lattice-Based Continuum Formulation for the Coupled Thermodynamic and Mechanical Equilibrium of Polycrystalline Solids |
| | L. Bassman, K. Garikipati and M. Deal |
| | Stanford University, US |
| - | 3D Modeling of Metallic Grain Growth |
| | D. George, N. Carlson, J.T. Gammel and A. Kuprat |
| | Los Alamos National Laboratory, US |
| - | Monte Carlo Modeling of Thin Film Deposition: Influence of Grain Boundaries on the Porosity of Barrier Layer Films |
| | J. Dalla Torre, G.H. Gilmer, D.L. Windt, F.H. Baumann, H. Huang, T. Díaz de la Rubia and M. Djafari Rouhani |
| | Bell Labs, Lucent Technologies, US |
| - | Modeling Nucleation and Growth of Voids During Electromigration |
| | D. Richards, J.B. Adams and L.J. Borucki |
| | Arizona State University, US |
| - | Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper |
| | P. Heino and E. Ristolainen |
| | Tampere University of Technology, FI |
| ISBN: | 0-9666135-4-6 |
| Pages: | 697 |
| Special: | 3 CD Set — 15% off with Free Shipping |
| Up | |
