Nano Science and Technology Institute
MSM 99
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems

Chapter 13:

Metallization Modeling

-Numerical Simulations of Sputter Deposition and Etching in Trenches Using the Level Set Technique
 P.L. O'Sullivan, F.H. Baumann and G.H. Gilmer
 Bell Laboratories, Lucent Technologies, US
-TopoSim3D/Grain3D: Modeling Surface Deposition and Growth
 J.T. Gammel and R. Walker
 Los Alamos National Laboratory, US
-Modeling Facet Growth of Cu Thin Films
 Z. Wang, Y. Li and J.B. Adams
 Arizona State University, US
-Computational Modeling with a New Lattice-Based Continuum Formulation for the Coupled Thermodynamic and Mechanical Equilibrium of Polycrystalline Solids
 L. Bassman, K. Garikipati and M. Deal
 Stanford University, US
-3D Modeling of Metallic Grain Growth
 D. George, N. Carlson, J.T. Gammel and A. Kuprat
 Los Alamos National Laboratory, US
-Monte Carlo Modeling of Thin Film Deposition: Influence of Grain Boundaries on the Porosity of Barrier Layer Films
 J. Dalla Torre, G.H. Gilmer, D.L. Windt, F.H. Baumann, H. Huang, T. Díaz de la Rubia and M. Djafari Rouhani
 Bell Labs, Lucent Technologies, US
-Modeling Nucleation and Growth of Voids During Electromigration
 D. Richards, J.B. Adams and L.J. Borucki
 Arizona State University, US
-Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper
 P. Heino and E. Ristolainen
 Tampere University of Technology, FI
ISBN:0-9666135-4-6
Pages:697
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