MSM 99
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems

Metallization Modeling Chapter 13

Numerical Simulations of Sputter Deposition and Etching in Trenches Using the Level Set Technique
P.L. O'Sullivan, F.H. Baumann and G.H. Gilmer
Bell Laboratories, Lucent Technologies, US

TopoSim3D/Grain3D: Modeling Surface Deposition and Growth
J.T. Gammel and R. Walker
Los Alamos National Laboratory, US

Modeling Facet Growth of Cu Thin Films
Z. Wang, Y. Li and J.B. Adams
Arizona State University, US

Computational Modeling with a New Lattice-Based Continuum Formulation for the Coupled Thermodynamic and Mechanical Equilibrium of Polycrystalline Solids
L. Bassman, K. Garikipati and M. Deal
Stanford University, US

3D Modeling of Metallic Grain Growth
D. George, N. Carlson, J.T. Gammel and A. Kuprat
Los Alamos National Laboratory, US

Monte Carlo Modeling of Thin Film Deposition: Influence of Grain Boundaries on the Porosity of Barrier Layer Films
J. Dalla Torre, G.H. Gilmer, D.L. Windt, F.H. Baumann, H. Huang, T. Díaz de la Rubia and M. Djafari Rouhani
Bell Labs, Lucent Technologies, US

Modeling Nucleation and Growth of Voids During Electromigration
D. Richards, J.B. Adams and L.J. Borucki
Arizona State University, US

Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper
P. Heino and E. Ristolainen
Tampere University of Technology, FI


ISBN: 0-9666135-4-6
Pages: 697