Authors: J. Sieiro, A. Morrissey, M. Carmona, S. Marco, J. Samitier and J. Alderman
Affilation: Universitat de Barcelona, Spain
Pages: 168 - 173
Keywords: thermal modeling, package simulation
This paper descubes the thermal behaviour of vertical multichip module (V-MCM) devised within the BARMINT Esprit Project. It encloses an stack of elements including several ICs. a micromachined pump, and a multisensor chip provided with pressure sensors, ISFETs and temperature sensors together with signal conditioning circuitry. All these elements are embedded in a ,D cube made of PLCC (Plastic Leadless Chip Carriers).