Nano Science and Technology Institute
MSM 98
MSM 98
Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
 
Chapter 4: Thermo-Mechanical Modeling
 

Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics

Authors:J. Sieiro, A. Morrissey, M. Carmona, S. Marco, J. Samitier and J. Alderman
Affilation:Universitat de Barcelona, ES
Pages:168 - 173
Keywords:thermal modeling, package simulation
Abstract:This paper descubes the thermal behaviour of vertical multichip module (V-MCM) devised within the BARMINT Esprit Project. It encloses an stack of elements including several ICs. a micromachined pump, and a multisensor chip provided with pressure sensors, ISFETs and temperature sensors together with signal conditioning circuitry. All these elements are embedded in a,D cube made of PLCC (Plastic Leadless Chip Carriers).
Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated ElectronicsView PDF of paper
ISBN:0-96661-35-0-3
Pages:678
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