| |
 | MSM 98
Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
Chapter 4: Thermo-Mechanical Modeling |
| | Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics | | Authors: | J. Sieiro, A. Morrissey, M. Carmona, S. Marco, J. Samitier and J. Alderman | | Affilation: | Universitat de Barcelona, Spain | | Pages: | 168 - 173 | | Keywords: | thermal modeling, package simulation | | Abstract: | This paper descubes the thermal behaviour of vertical multichip module (V-MCM) devised within the BARMINT Esprit Project. It encloses an stack of elements including several ICs. a micromachined pump, and a multisensor chip provided with pressure sensors, ISFETs and temperature sensors together with signal conditioning circuitry. All these elements are embedded in a,D cube made of PLCC (Plastic Leadless Chip Carriers). |  | View paper | | ISBN: | 0-96661-35-0-3 |
| Pages: | 678 |
| Hardcopy: | $100.00 |
| Special: | 3 CD Set — 15% off with Free Shipping |
| Up | |
|
| nanoPRwire™ |
 |
| News Headlines |
 |
|
|
| |
| |
|
| | |
| |
|
|
