Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics

	MSM 98 Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems Chapter 4: Thermo-Mechanical Modeling
	Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics
Authors:	J. Sieiro, A. Morrissey, M. Carmona, S. Marco, J. Samitier and J. Alderman
Affilation:	Universitat de Barcelona, ES
Pages:	168 - 173
Keywords:	thermal modeling, package simulation
Abstract:	This paper descubes the thermal behaviour of vertical multichip module (V-MCM) devised within the BARMINT Esprit Project. It encloses an stack of elements including several ICs. a micromachined pump, and a multisensor chip provided with pressure sensors, ISFETs and temperature sensors together with signal conditioning circuitry. All these elements are embedded in a,D cube made of PLCC (Plastic Leadless Chip Carriers).
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ISBN:	0-96661-35-0-3
Pages:	678
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