MSM 98
MSM 98
Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems

Thermo-Mechanical Modeling Chapter 4

Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics

Authors: J. Sieiro, A. Morrissey, M. Carmona, S. Marco, J. Samitier and J. Alderman

Affilation: Universitat de Barcelona, Spain

Pages: 168 - 173

Keywords: thermal modeling, package simulation

Abstract:
This paper descubes the thermal behaviour of vertical multichip module (V-MCM) devised within the BARMINT Esprit Project. It encloses an stack of elements including several ICs. a micromachined pump, and a multisensor chip provided with pressure sensors, ISFETs and temperature sensors together with signal conditioning circuitry. All these elements are embedded in a ,D cube made of PLCC (Plastic Leadless Chip Carriers).

Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics

ISBN: 0-96661-35-0-3
Pages: 678