Nano Science and Technology Institute
MSM 98
MSM 98
Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems

Chapter 4:

Thermo-Mechanical Modeling

-Reduced Electro-Thermal Models for Integrated Circuits
 M. Furmanczyk, A. Napieralski, K. Szaniawski, W. Tylman and A. Lara
 Technical University of Lodz, PL
-Elements for Modeling Diffused Piezoresistor Temperature Coefficient and Sensitivity
 D. Mladenovic, J. Hutchins, E. Tran and S. Lu
 Motorola, US
-A Least Squares Algorithm for Optimal Heater Placement in Microsensors
 C.C. Liu, P.F. Man and C.H. Mastrangelo
 University of Michigan, US
-Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations
 S. Marco, M. Carmona and J. Samitier
 Universitat de Barcelona, ES
-Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages
 C. Hager, Y. Tronel and W. Fichtner
 ETH-EPFL, CH
-Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics
 J. Sieiro, A. Morrissey, M. Carmona, S. Marco, J. Samitier and J. Alderman
 Universitat de Barcelona, ES
ISBN:0-96661-35-0-3
Pages:678
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