Thermo-Mechanical Modeling

	MSM 98 Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems Chapter 4: Thermo-Mechanical Modeling
-	Reduced Electro-Thermal Models for Integrated Circuits
	M. Furmanczyk, A. Napieralski, K. Szaniawski, W. Tylman and A. Lara
	Technical University of Lodz, Poland
-	Elements for Modeling Diffused Piezoresistor Temperature Coefficient and Sensitivity
	D. Mladenovic, J. Hutchins, E. Tran and S. Lu
	Motorola, U.S.A.
-	A Least Squares Algorithm for Optimal Heater Placement in Microsensors
	C.C. Liu, P.F. Man and C.H. Mastrangelo
	University of Michigan, U.S.A.
-	Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations
	S. Marco, M. Carmona and J. Samitier
	Universitat de Barcelona, Spain
-	Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages
	C. Hager, Y. Tronel and W. Fichtner
	ETH-EPFL, Switzerland
-	Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics
	J. Sieiro, A. Morrissey, M. Carmona, S. Marco, J. Samitier and J. Alderman
	Universitat de Barcelona, Spain
ISBN:	0-96661-35-0-3
Pages:	678
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