 | MSM 98
Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
Chapter 4: Thermo-Mechanical Modeling |
| - | Reduced Electro-Thermal Models for Integrated Circuits |
| | M. Furmanczyk, A. Napieralski, K. Szaniawski, W. Tylman and A. Lara |
| | Technical University of Lodz, Poland |
| - | Elements for Modeling Diffused Piezoresistor Temperature Coefficient and Sensitivity |
| | D. Mladenovic, J. Hutchins, E. Tran and S. Lu |
| | Motorola, U.S.A. |
| - | A Least Squares Algorithm for Optimal Heater Placement in Microsensors |
| | C.C. Liu, P.F. Man and C.H. Mastrangelo |
| | University of Michigan, U.S.A. |
| - | Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations |
| | S. Marco, M. Carmona and J. Samitier |
| | Universitat de Barcelona, Spain |
| - | Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages |
| | C. Hager, Y. Tronel and W. Fichtner |
| | ETH-EPFL, Switzerland |
| - | Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics |
| | J. Sieiro, A. Morrissey, M. Carmona, S. Marco, J. Samitier and J. Alderman |
| | Universitat de Barcelona, Spain |
| ISBN: | 0-96661-35-0-3 |
| Pages: | 678 |
| Special: | 3 CD Set — 15% off with Free Shipping |
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