Authors: T-R. Hsu and N. Sun
Affilation: San Jose State University, United States
Pages: 82 - 87
Keywords: stress, strain, MEMS, FEM
This paper describes the development of a finite element based MEMPACK code developed by the lead author and his graduate students. The MEMPACK code will be used for simulation and prediction of residual stresses and strains induced in microelectromechanical (MEM) devices during fabrication. It will also be used for the packaging design of MEMS. A case study is presented to illustrate the significant residual stresses and strains induced in a MEM device by a fabrication process.