Bulk and Topography Processing

	MSM 98 Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems Chapter 2: Bulk and Topography Processing
-	Molecular Dynamics (MD) Simulations of Reactive Ion Etching (RIE) of Silicon by Cl, Cl2, Br and Br2 Cations
	S.M. Valone, D.E. Hanson and J.D. Kress
	Los Alamos National Laboratory, U.S.A.
-	Computer Aided Mask-Layout for Bulk Etch Fabrication
	M.K Long, J.W. Burdick and E.K. Antonsson
	California Institute of Technology, U.S.A.
-	A Semi-Empirical Resist Dissolution Model for Sub-micron Lithographies
	M. Khan, S.B. Bollepalli and F. Cerrina
	UW-Madison, U.S.A.
-	A Method of MOSFET Dopant Profile Prediction and its Use in Transistor Design
	M. Kulkarni, K. Vasanath, J. Davis, S. Saxena and G. Pollack
	Texas Instruments, Inc., U.S.A.
-	Modeling Image Formation in Layered Structures: Application to X-ray Lithography
	S.B. Bollepalli, M. Khan and F. Cerrina
	UW-Madison, U.S.A.
-	Numerical Simulation for the Sacrificial Release of MEMS Square Diaphragms
	W.J. Li, J.C. Shih, J.D. Mai, C-M. Ho, J. Liu and Y-C. Tai
	UC-Los Angeles, U.S.A.
-	Three-Dimensional Simulation of Bulge Formation in Contact Hole Metalization
	W. Pyka and S. Selberherr
	Technical UniversityVienna, Austria
ISBN:	0-96661-35-0-3
Pages:	678
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