 | MSM 98
Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
Chapter 2: Bulk and Topography Processing |
| - | Molecular Dynamics (MD) Simulations of Reactive Ion Etching (RIE) of Silicon by Cl, Cl2, Br and Br2 Cations |
| | S.M. Valone, D.E. Hanson and J.D. Kress |
| | Los Alamos National Laboratory, U.S.A. |
| - | Computer Aided Mask-Layout for Bulk Etch Fabrication |
| | M.K Long, J.W. Burdick and E.K. Antonsson |
| | California Institute of Technology, U.S.A. |
| - | A Semi-Empirical Resist Dissolution Model for Sub-micron Lithographies |
| | M. Khan, S.B. Bollepalli and F. Cerrina |
| | UW-Madison, U.S.A. |
| - | A Method of MOSFET Dopant Profile Prediction and its Use in Transistor Design |
| | M. Kulkarni, K. Vasanath, J. Davis, S. Saxena and G. Pollack |
| | Texas Instruments, Inc., U.S.A. |
| - | Modeling Image Formation in Layered Structures: Application to X-ray Lithography |
| | S.B. Bollepalli, M. Khan and F. Cerrina |
| | UW-Madison, U.S.A. |
| - | Numerical Simulation for the Sacrificial Release of MEMS Square Diaphragms |
| | W.J. Li, J.C. Shih, J.D. Mai, C-M. Ho, J. Liu and Y-C. Tai |
| | UC-Los Angeles, U.S.A. |
| - | Three-Dimensional Simulation of Bulge Formation in Contact Hole Metalization |
| | W. Pyka and S. Selberherr |
| | Technical UniversityVienna, Austria |
| ISBN: | 0-96661-35-0-3 |
| Pages: | 678 |
| Special: | 3 CD Set — 15% off with Free Shipping |
| Up | |
